The effect of ultrasonic treatment on the mobility of short surface disloca
tions in Si crystals is investigated. It is found that ultrasonic treatment
of Si crystals changes the velocity of dislocations under a permanent mech
anical load. The nature of variation of dislocation velocity is determined
by the sign of external stresses acting on the sample: compressive forces d
ecrease while tensile forces increase the velocity of dislocations. After u
ltrasonic treatment of the samples, a decrease in the activation energy for
dislocation motion and the enhancement of the electroplastic effect are ob
served. A possible mechanism of the observed effects is considered. (C) 200
0 MAIK "Nauka/Interperiodica".