In order to realize a micropump with a shape memory alloy (SMA) diaphragm a
ctuator, TiNi thin film of about 7 mu m in thickness was deposited by flash
evaporation and its dynamic deformation-shape recovery properties were stu
died using a bulge test. The TiNi diaphragm was deformed by applying a gas
pressure of 200 kPa heated resistively to recover its initial flat shape, a
nd then air-cooled to achieve deformation once again. During this thermal c
ycle, temperature and deflection of the diaphragm were monitored at its cen
ter. In order to monitor temperature, we fabricated a Cu-Ni micro thermocou
ple on the diaphragm by conventional evaporation. When the diaphragm was he
ated, shape recovery occurred at about 60 degrees C. This continued after t
he temperature for termination of reverse martensitic transformation, Af (a
bout 70 degrees C), had been reached. Moreover, when the diaphragm was air-
cooled, redeformation began even at temperatures higher than that for the c
ommencement of martensitic transformation, Ms (about 60 degrees C). From a
FEM simulation and temperature measurements taken using thermography, these
results could be explained by the temperature gradient formed in the diaph
ragm due to thermal conduction. When heating rate was increased, time requi
red to complete shape recovery decreased and maximum displacement for shape
recovery increased. This could also be explained in terms of the temperatu
re gradient. (C) 2000 Elsevier Science S.A. All rights reserved.