Microstructures of microcrystalline silicon thin films prepared by hot wire chemical vapor deposition

Citation
M. Zhu et al., Microstructures of microcrystalline silicon thin films prepared by hot wire chemical vapor deposition, THIN SOL FI, 360(1-2), 2000, pp. 205-212
Citations number
27
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
THIN SOLID FILMS
ISSN journal
00406090 → ACNP
Volume
360
Issue
1-2
Year of publication
2000
Pages
205 - 212
Database
ISI
SICI code
0040-6090(20000201)360:1-2<205:MOMSTF>2.0.ZU;2-P
Abstract
Undoped hydrogenated microcrystalline silicon (mu c-Si:H) thin films were p repared at low temperature by hot wire chemical vapor deposition (HWCVD). M icrostructures of the mu c-Si:H films with different H-2/SiH4 ratios and de position pressures have been characterized by infrared spectroscopy X-ray d iffraction (XRD), Raman scattering, Fourier transform (FTIR), cross-section al transmission electron microscopy (TEM) and small angle X-ray scattering (SAX). The crystallization of silicon thin film was enhanced by hydrogen di lution and deposition pressure. The TEM result shows the columnar growth of mu c-Si:H thin films. An initial microcrystalline Si layer on the glass su bstrate, instead of the amorphous layer commonly observed in plasma enhance d chemical vapor deposition (PECVD), was observed from TEM and backside inc ident Raman spectra. The SAXS data indicate an enhancement of the mass dens ity of mu c-Si:H films by hydrogen dilution. Finally, combining the FTIR da ta with the SAXS experiment suggests that the Si--H bonds in mu c-Si:H and in polycrystalline Si thin films are located at the grain boundaries. (C) 2 000 Elsevier Science S.A. All rights reserved.