Resonant laser ablation of copper and its application in microanalysis

Citation
St. Dai et al., Resonant laser ablation of copper and its application in microanalysis, APPL PHYS A, 69, 1999, pp. S167-S169
Citations number
27
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING
ISSN journal
09478396 → ACNP
Volume
69
Year of publication
1999
Supplement
S
Pages
S167 - S169
Database
ISI
SICI code
0947-8396(199912)69:<S167:RLAOCA>2.0.ZU;2-A
Abstract
Resonant laser ablation (RLA) is a two-step process, occurring within a pul se of a tunable laser, in which the leading edge of the laser pulse ablates a solid surface to produce neutral atoms or molecules that are then resona ntly ionized by the trailing edge of the same laser pulse. The sensitivity and selectivity of RLA allow detection and quantitation at very low concent rations. In our preliminary RLA research, a sub-ppm detection level has bee n reached for copper in a standard aluminium sample. In addition, the thres hold and saturation effects of RLA have been observed.