M. Lagadas et al., ELECTRICAL-PROPERTIES OF N-GAAS EPILAYERS, FET AND HEMT STRUCTURES GROWN ON LT-GAAS BY MBE, Materials science & engineering. B, Solid-state materials for advanced technology, 44(1-3), 1997, pp. 355-358
We have investigated the dependence of the conductive layer width and
Hall mobility in n-GaAs/LT-GaAs structures on the conditions of low te
mperature (LT) buffer growth and on annealing parameters. Both the con
ductive layer width, as determined from electrochemical C-V profiling,
as well as the carrier mobility of the doped epilayer decrease as the
LT-GaAs growth temperature is reduced and decrease with duration and
temperature of annealing. This degradation is attributed to the outdif
fusion of excess arsenic and the formation of arsenic precipitates in
the n-GaAs epilayer and to the outdiffusion of point defects, as indic
ated by Photoluminescence observations. The use of AlxGa1-xAs/GaAs sup
erlattice and GaAs as intermediate layers between the LT buffer and th
e active layers in field effect transistor (FET) and high electron mob
ility transistor (HEMT) structures results in maintaining both carrier
mobility and doping profile at conventional layer levels. The improve
ment is attributed to the suppression of excess As and point defect ou
tdiffusion from the LT-GaAs to the active layer. (C) 1997 Elsevier Sci
ence S.A.