Fabrication of a quantum point contact by the dynamic plowing technique and wet-chemical etching

Citation
S. Skaberna et al., Fabrication of a quantum point contact by the dynamic plowing technique and wet-chemical etching, ULTRAMICROS, 82(1-4), 2000, pp. 153-157
Citations number
16
Categorie Soggetti
Multidisciplinary,"Spectroscopy /Instrumentation/Analytical Sciences
Journal title
ULTRAMICROSCOPY
ISSN journal
03043991 → ACNP
Volume
82
Issue
1-4
Year of publication
2000
Pages
153 - 157
Database
ISI
SICI code
0304-3991(200002)82:1-4<153:FOAQPC>2.0.ZU;2-3
Abstract
We have fabricated extremely confined ballistic constrictions using a nanol ithography technique based on an atomic force microscope. Vector-scan contr olled dynamic plowing with the vibrating tip enables to plastically indent a thin resist layer along a prearranged path. Transfer of the resist patter n into the semiconductor substrate is achieved by a strongly diluted aqueou s etchant. In this way approximately 30 nm deep gooves were etched in the c hannel area of a modulation-doped GaAs/GaAlAs field-effect transistor. The quantum point contacts were defined by a broken line whose 60 nm width repr esents the length and the sub-100 nm gap determines the width of the constr iction. At liquid-helium temperature the conductance as a function of gate voltage shows a stepwise increase in units of 2e(2)/h. Signatures of the co nductance quantization persist up to 50 K, which indicates a large subband spacing. (C) 2000 Elsevier Science B.V. All rights reserved.