A planar GaAs MOSFET has been realised in which ion implantation is used fo
r device isolation and wet thermal oxidation of Al0.98Ga0.02As for both the
gate insulation and channel encapsulation. Selective etches of AlGaAs/GaAs
and Al2O3/GaAs were incorporated in the device fabrication. The depletion-
mode device has a threshold voltage of about -4V, a transconductance of 23.
9mS/mm and a low gate leakage current.