Voltage scaling of ferroelectric thin films deposited by CVD

Citation
Sm. Bilodeau et al., Voltage scaling of ferroelectric thin films deposited by CVD, INTEGR FERR, 26(1-4), 1999, pp. 821-837
Citations number
6
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Eletrical & Eletronics Engineeing
Journal title
INTEGRATED FERROELECTRICS
ISSN journal
10584587 → ACNP
Volume
26
Issue
1-4
Year of publication
1999
Pages
821 - 837
Database
ISI
SICI code
1058-4587(1999)26:1-4<821:VSOFTF>2.0.ZU;2-6
Abstract
For many applications of ferroelectric ICs it is desirable to operate ferro electric memory at the lowest possible power and voltage. One way to reduce the operating voltage is to reduce film thickness. We report on the electr ical properties of MOCVD deposited PZT 40/60 and 20/80 films as a function of film thickness. As the thickness is reduced, switched polarization at sa turation (P*-P-boolean AND) is reduced, but the coercive E-field is not sub stantially changed. Films also have imprint and fatigue behavior that is in dependent of film thickness when operated at constant electric field. For f ilms below 60nm the leakage current rises rapidly; this is likely due to th e effects of film roughness. For 65nm films of the PZT 20/80 material, we o bserved well formed hysteresis loops and P-sw > 55 mu C/cm(2) at 1.2V; pola rization was greater than 90% saturated at that voltage.