Ferroelectric memories (FeRAMs) are new types of memories especially suitab
le for mobile applications due to their unique properties like non-volatili
ty, small DRAM-like cell size, fast read and write as well as low voltage/l
ow power behavior. Although standard CMOS processes can be used for fronten
d and backend processes, FeRAM technology development has to overcome major
challenges due to new materials used for capacitor formation. This work gi
ves an overview of SrBi2Ta2O9 (SBT) thin films capacitor processing using P
t as electrode material. The study describes in derail SBT formation using
metal organic deposition (MOD) as well as influence of electrode thickness
and capacitor patterning on SBT electrical properties. Also, results for in
tegration of the capacitor process into a 0.5 mu m CMOS process with 2-laye
r tungsten/aluminum metallization as well as stacked capacitor results are
given.