Ga. Hirata et J. Mckittrick, Ferroelectric and microstructure properties of Ba1-xSrxTiO3 films grown ondifferent electrodes, INTEGR FERR, 24(1-4), 1999, pp. 85-94
Ferroelectric Ba1-xSrxTiO3 thin films were deposited by pulsed laser ablati
on on SiO2/Si, RuO2/Ta/SiO2/Si and Pt/Ti/SiO2/Si substrates. The films were
weakly crystalline in the as-deposited condition and subsequent crystalliz
ation was induced by annealing the films in the range of 550-650 degrees C.
The BST films deposited on Pt/Ti/SiO2/c-Si substrates presented wide crack
s that were promoted during the annealing process due to the thermal expans
ion mismatch between the BST films (alpha(BST) = 4 x 10(-6) degrees C-1) an
d the Pt (alpha(Pt) = 9 x 10(-6) degrees C-1). Smooth films showing slightl
y crackeded areas were obtained on SiO2/c-Si and RuO2/Ta/SiO2/Si substrates
. The ruthenium oxide thermal expansion coefficient is alpha(RuO2) = 5.2 x
10(-6) degrees C-1. A cross-sectional analysis at the ferroelectric/substra
te interface showed that for the lower annealing temperature (550 degrees C
) a mixed amorphous/nanocrystalline microstructure is formed. For temperatu
res above 600 degrees C a randomly oriented polycrystalline material is obt
ained. However, an amorphous layer of 4-6 nm still remains on the substrate
even after heat-treatments up to 650 degrees C. The dielectric constant of
the BST films varied in the range of 30-325.