Transient, three-dimensional heat transfer model for the laser assisted machining of silicon nitride: I. Comparison of predictions with measured surface temperature histories
Jc. Rozzi et al., Transient, three-dimensional heat transfer model for the laser assisted machining of silicon nitride: I. Comparison of predictions with measured surface temperature histories, INT J HEAT, 43(8), 2000, pp. 1409-1424
Laser assisted machining (LAM), in which the material is locally heated by
an intense laser source prior to material removal, provides an alternative
machining process with the potential to yield higher material removal rates
, as well as improved control of workpiece properties and geometry, for dif
ficult-to-machine materials such as structural ceramics. To assess the feas
ibility of the LAM process and to obtain an improved understanding of gover
ning physical phenomena, experiments have been performed to determine the t
hermal response of a rotating silicon nitride workpiece undergoing heating
by a translating CO2 laser and material removal by a cutting tool. Using a
focused laser pyrometer, surface temperature histories were measured to det
ermine the effect of the rotational and translational speeds, the depth of
cut, the laser-tool lead distance, and the laser beam diameter and power on
thermal conditions. The measurements are in excellent agreement with predi
ctions based on a transient, three-dimensional numerical solution of the he
ating and material removal processes. The temperature distribution within t
he unmachined workpiece is most strongly influenced by the laser power and
laser-tool lead distance, as well as by the laser/tool translational veloci
ty. A minimum allowable operating temperature in the material removal regio
n corresponds to the YSiAlON glass transition temperature, below which tool
fracture may occur. In a companion paper [1], the numerical model is used
to further elucidate thermal conditions associated with laser assisted mach
ining. (C) 2000 Elsevier Science Ltd. All rights reserved.