Transient liquid phase bonding process using liquid phase sintered alloy as an interlayer material

An attempt was made of using a liquid phase sintered alloy, which will be a liquid phase coexisting with solid particles at the bonding temperature, a s an interlayer for bonding metals. With an aim of revealing the fundamenta l features of this modified TLP bonding, investigated were the kinetics con cerned with the isothermal solidification process and the growth of solid p articles in Fe-4.5wt%P and Fe-1.16wt%B interlayers for bonding pure iron. T he movement of the bond interface was linearly dependent on t(1/2) with hig her slope than expected in the normal TLP bonding. The higher slope is attr ibuted to the contribution of the solid particles distributed in the interl ayer. The solid particles have shown no growth. However, when pure Fe parti cles are allowed to coexist with the liquid of equilibrium composition, the y grows very rapidly. Discussion was made on the growth kinetics of the pur e Fe particles. (C) 2000 Kluwer Academic Publishers.