In this paper we present a fabrication process for nanometer scale silicon
pillars. High aspect ratio and smooth sidewalls of the pillars are obtained
by reactive ion etching of self-organized gold-chromium masked silicon. Af
ter annealing, a thin Au/Cr film is converted to the disordered array of me
tal particles. The particle diameter and density could be controlled by var
ying the thickness of the films. A set of experiments in fluorine based pla
smas has been carried out in order to investigate the processing of silicon
quantum pillars. The results show that the mask has a low speed of erosion
. Sidewall evolution during low rf power etching has been analyzed. The pro
cess parameters for realizing high-anisotropy pillars of different shapes h
ave been found. (C) 2000 Elsevier Science S.A. All rights reserved.