Automated tape placement with in-situ electron beam cure

Citation
Dl. Goodman et al., Automated tape placement with in-situ electron beam cure, SAMPE J, 36(2), 2000, pp. 11-17
Citations number
12
Categorie Soggetti
Material Science & Engineering
Journal title
SAMPE JOURNAL
ISSN journal
00911062 → ACNP
Volume
36
Issue
2
Year of publication
2000
Pages
11 - 17
Database
ISI
SICI code
0091-1062(200003/04)36:2<11:ATPWIE>2.0.ZU;2-1
Abstract
Automated tape placement (ATP) ia widely used in the aerospace industry to produce large composite structures with complex geometry. An innovative pro cess combining ATP with in-situ electron beam (LB) curing has the potential to decrease composite part costs, especially for large integrated structur es. A group consisting of Science Research Laboratory, Applied Poleramics a nd Northrop-Grumman is currently developing results, tape and electron gun technology for in-situ curing of ATP composites. ([1]) This paper presents mechanical and thermal properties for composite panels fabricated using a simulated in-sun EB cure process, with comparison to pan els cured in a single step EB process. We can also present design tradeoffs for in-situ EB curing systems and describe how the choice of processing ge ometry affects the design. SRI has fabricated an in-situ EB curing system b ased on these design. The portable robotic EB gun will be combined with an existing ATP head at the NASA Marshall Space Flight Center for demonstratio n of the in-situ curing process later this year.