A. Matsuda, RECENT UNDERSTANDING OF THE GROWTH-PROCESS OF AMORPHOUS-SILICON FROM A SILANE GLOW-DISCHARGE PLASMA, Plasma physics and controlled fusion, 39(5A), 1997, pp. 431-436
The film growth process of hydrogenated amorphous silicon (a-Si:H) fro
m a monosilane glow-discharge plasma as been investigated as a represe
ntative case of thin him growth from a glow-discharge plasma. On the b
asis of our understanding of the gas phase as well as surface-reaction
processes obtained from the results of a variety of process diagnoses
such as infrared laser-absorption spectroscopy and infrared reflectio
n-absorption spectroscopy, a reaction model explaining the determinati
on step of defect density in the resulting a-Si:H has been proposed. T
he defect (dangling bond) density of a-Si:H has been controlled throug
h the surface-diffusion length of silyl radicals produced in the monos
ilane plasma. This allows us to obtain low defect density a-Si:H havin
g a range of optical band gaps and to avoid the use of alloying with e
lements other than hydrogen. At high temperature, precursor assisted d
efect suppression (PADS) produces a low band gap and defect density. A
t low temperature, heating of precursors in the gas phase allows defec
t reduction by energized precursors (DREP) to attain lower defect dens
ity. Furthermore, the electron and hole mobilities in the resulting a-
Si:H have been controlled by making use of the kinetic energy of ionic
species impinging on the film-growing surface from the plasma.