Probabilistic thermal-shock strength testing using infrared imaging

A thermal-shock strength-testing technique has been developed that uses a h igh-resolution, high-temperature infrared camera to capture a specimen's su rface temperature distribution at fracture. Aluminum nitride (AIN) substrat es are thermally shocked to fracture to demonstrate the technique. The surf ace temperature distribution for each test and AIN's thermal expansion are used as input in a finite-element model to determine the thermal-shock stre ngth for each specimen. An uncensored thermal-shock strength Weibull distri bution is then determined. The test and analysis algorithm show promise as a means to characterize thermal shock strength of ceramic materials.