Growth of a Au-Ni-Sn intermetallic compound on the solder-substrate interface after aging

Authors
Minor, AM Morris, JW
Citation
Am. Minor et Jw. Morris, Growth of a Au-Ni-Sn intermetallic compound on the solder-substrate interface after aging, MET MAT T A, 31(3), 2000, pp. 798-800
Citations number
7
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science",Metallurgy
Journal title
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE
ISSN journal
10735623 → ACNP
Volume
31
Issue
3
Year of publication
2000
Pages
798 - 800
Database
ISI
SICI code
1073-5623(200003)31:3<798:GOAAIC>2.0.ZU;2-T