Effect of drain voltage on channel temperature and reliability of pseudomorphic InP-based HEMTs

Citation
M. Dammann et al., Effect of drain voltage on channel temperature and reliability of pseudomorphic InP-based HEMTs, MICROEL REL, 40(2), 2000, pp. 287-291
Citations number
12
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
MICROELECTRONICS RELIABILITY
ISSN journal
00262714 → ACNP
Volume
40
Issue
2
Year of publication
2000
Pages
287 - 291
Database
ISI
SICI code
0026-2714(200002)40:2<287:EODVOC>2.0.ZU;2-E
Abstract
By performing biased accelerated life tests and three dimensional temperatu re simulations the effect of drain voltage on reliability and channel tempe rature of pseudomorphic InAlAs/InGaAs HEMTs for low noise applications was investigated. At V-d = 1 V excellent long term stability in nitrogen ambien t was observed. Increasing the drain voltage to V-d = 2 V at constant chann el temperature leads to a faster degradation rate which is caused by field accelerated degradation mechanism, probably involving fluorine diffusion. T he influence of gate width on channel temperature and reliability was found to be small. (C) 2000 Elsevier Science Ltd. All rights reserved.