M. Dammann et al., Effect of drain voltage on channel temperature and reliability of pseudomorphic InP-based HEMTs, MICROEL REL, 40(2), 2000, pp. 287-291
By performing biased accelerated life tests and three dimensional temperatu
re simulations the effect of drain voltage on reliability and channel tempe
rature of pseudomorphic InAlAs/InGaAs HEMTs for low noise applications was
investigated. At V-d = 1 V excellent long term stability in nitrogen ambien
t was observed. Increasing the drain voltage to V-d = 2 V at constant chann
el temperature leads to a faster degradation rate which is caused by field
accelerated degradation mechanism, probably involving fluorine diffusion. T
he influence of gate width on channel temperature and reliability was found
to be small. (C) 2000 Elsevier Science Ltd. All rights reserved.