Thermally activated flux creep in YBa2Cu3O7-x film

Citation
Il. Landau et Hr. Ott, Thermally activated flux creep in YBa2Cu3O7-x film, PHYSICA C, 331(1), 2000, pp. 1-12
Citations number
25
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
PHYSICA C
ISSN journal
09214534 → ACNP
Volume
331
Issue
1
Year of publication
2000
Pages
1 - 12
Database
ISI
SICI code
0921-4534(20000401)331:1<1:TAFCIY>2.0.ZU;2-K
Abstract
We report on a study of thermally activated flux creep in a ring-shaped epi taxial YBa2Cu3O7-x film over a wide range of temperatures, using an experim ental technique that allows us to obtain voltage-current (V-I) characterist ics of the sample at low voltages without electric contacts to the film. It is shown that in the temperature range between 10 and 60 K, the flux creep can be described in terms of a thermally activated hopping of vortices ove r potential barriers. Taking into account the temperature dependence of the critical current, all V-I characteristics in the above temperature range m ay be merged onto a single continuous curve, from which the current depende nce of the activation energy for 0.4 <I/I-c < 0.9 may be established. Subse quently, this information allows us to reconstruct the profile of potential barriers in real space. (C) 2000 Elsevier Science B.V. All rights reserved .