VLSI-NEMS chip for parallel AFM data storage

We report the microfabrication of a 32 X 32 (1024) 2D cantilever array chip and its electrical testing. It has been designed for ultrahigh-density, hi gh-speed data storage applications using thermomechanical writing and reado ut in thin polymer film storage media. The fabricated chip is the first ver y large scale integration (VLSI)-NEMS (NanoEMS) for nanotechnological appli cations. For electrical and thermal stability, the levers are made of silic on, and the heater/sensor element is defined as a lower, doped platform wit h the tip on top. Freestanding cantilevers are obtained with surface-microm achining techniques, which yield better mechanical stability and heatsinkin g of the chip than bulk-micromachining releasing techniques do. Two-wiring levels interconnect the cantilevers for a time-multiplexed row/column addre ssing scheme. By integrating a Schottky diode in series with each cantileve r, a considerable reduction of crosstalk between cantilevers has been achie ved. (C) 2000 Elsevier Science B.V. All rights reserved.