Restoration mechanisms in highly deformed Cu-based conductor wires

Conductor wires used in pulsed magnets are traditionally fabricated by wire drawing. The strength of the conductors is influenced by the microstructur e, which is partly dependent on the restoration mechanisms occurring during processing. This study provides an insight into the types of restoration m echanisms occurring during wire drawing of OFHC copper. The effects of the restoration mechanisms on the mechanical and electrical properties of the m aterial were determined. Tensile test revealed the existence of steady stat e stress followed by strength softening at large processing strain. Optical and Orientation Imaging Microscopy (OIM) showed that the strength softenin g coincided with the onset of recrystallization in the material. Although r estoration mechanisms of recovery and recrystallization played some role in the strengthening they had little or no effect on the resistivity of the m aterial.