Thermal stress-induced thermoplastic composite debonding, studied by contact electrical resistance measurement

Authors
Mei, Z Chung, DDL
Citation
Z. Mei et Ddl. Chung, Thermal stress-induced thermoplastic composite debonding, studied by contact electrical resistance measurement, INT J ADHES, 20(2), 2000, pp. 135-139
Citations number
4
Categorie Soggetti
Material Science & Engineering
Journal title
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES
ISSN journal
01437496 → ACNP
Volume
20
Issue
2
Year of publication
2000
Pages
135 - 139
Database
ISI
SICI code
0143-7496(200002)20:2<135:TSTCDS>2.0.ZU;2-I
Abstract
Thermal stress-induced debonding of polyphenylenesulfide from polyphenylene sulfide was studied nondestructively by measurement of the contact electric al resistance between members containing continuous unidirectional carbon f ibers at 90 degrees. The resistance increased by up to 600% upon debonding. The resistance increase was much greater than the resistance decrease duri ng prior bonding. Debonding occurred during cooling when the pressure or te mperature during prior bonding was not sufficiently high. (C) 2000 Elsevier Science Ltd. All rights reserved.