A method of computing the concentration field of dissolved material inside
an etch-hole is presented. With a given velocity field, approximate convect
ion-diffusion equations are formulated using a number of assumptions, and a
nalytical descriptions for the concentration in different parts of the doma
in are obtained. By coupling these descriptions the concentration field can
be computed. The assumptions and the results are validated by comparison w
ith solutions based on a finite-volume method. Results of the boundary-laye
r method are given for two characteristic etch-hole geometries. The describ
ed boundary-layer method is efficient in terms of computational time and me
mory, because it does not require the construction of a computational grid
in the interior of the domain. This advantage will be exploited in a future
paper where the method will be used to simulate wet-chemical etching. (C)
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