Influence of block molecular weight on the adhesion properties of segmented polyamides

Citation
S. Ghosh et al., Influence of block molecular weight on the adhesion properties of segmented polyamides, J ADHES SCI, 14(4), 2000, pp. 529-543
Citations number
18
Categorie Soggetti
Material Science & Engineering
Journal title
JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY
ISSN journal
01694243 → ACNP
Volume
14
Issue
4
Year of publication
2000
Pages
529 - 543
Database
ISI
SICI code
0169-4243(2000)14:4<529:IOBMWO>2.0.ZU;2-T
Abstract
The effects of molecular weight variations in the hard and soft segments on the adhesion strength of segmented polyamides against aluminium, copper, a nd steel were investigated using 180 degrees peel strength measurements. It was found that the adhesion strength of the segmented polyamides was large ly influenced by block molecular weight variations. The nature of the subst rate, the rate of peeling, cooling in different environments, and thermal a geing, etc. had significant effects on the adhesion strength of the joints, whereas variation in the moulding conditions used in these experiments did not have much impact on the strength of the joints. The joint strength inc reased with a decrease in hard block molecular weight at a constant soft bl ock molecular weight of 1000, or with an increase in soft block molecular w eight at a constant hard block molecular weight of 1100.