We review defect studies in as-grown and processed silicon wafers performed
by the authors. These have resulted in improved understanding of substrate
-related defect formation, from nucleation during the pulling process throu
gh to evolution during subsequent device processing. We summarize our resul
ts on the impact of crystal pulling conditions on grown-in oxide precipitat
e nuclei size/density distributions, and on the transformation of D-defects
into oxide particles during high-temperature anneals. Finally, the effects
of vacancy and oxygen outdiffusion on denuded zone formation and on the gr
own-in precipitate nuclei in the near-surface region of silicon wafers are
compared. On several occasions, we also illustrate how the improved underst
anding of defect nucleation and transformation can be used to improve wafer
quality and device yield. (C) 2000 Elsevier Science B.V. All rights reserv
ed.