FUNDAMENTALS OF MCM TESTING AND DESIGN-FOR-TESTABILITY

Products motivated by performance-driven and/or density-driven goals o ften use Multi-Chip Module (MCM) technology, even though it still face s several challenging problems that need to be resolved before it beco mes a widely adopted technology. Among its most challenging problems i s achieving acceptable MCM assembly yields while meeting quality requi rements. This problem can be significantly reduced by adopting adequat e MCM test strategies: to guarantee the quality of incoming bare (unpa ckaged) dies prior to module assembly; to ensure the structural integr ity and performance of assembled modules; and to help isolate the defe ctive parts and apply the repair process. This paper describes today's MCM test problems and presents the corresponding test and design-for- testability (DFT) strategies used for bare dies, substrates, and assem bled MCMs.