Technology scaling demands shallower junctions for MOSFETs, making high-con
ductivity access to the intrinsic device harder to achieve. Considerable ef
fort has been devoted to improving process technology in order to reduce th
e sheet resistivity of shallow implanted layers. However, a calculation of
the components of resistance las a function of technology node suggests tha
t sheet resistance is unlikely to be a limiting factor in scaled MOSFETs. C
ontact and link-up resistance neighboring the channel will play an increasi
ngly important part in driving junction technology. (C) 2000 Academic Press
.