Low-cost, multi-GHz electrical packaging for serial optoelectronic links utilizing vertical cavity surface emitting lasers

Recent advances in semiconductor laser technology specifically the emergenc e of vertical cavity surface emitting lasers (VCSEL's), have created room f or substantial improvements in the performance of low-cost, fiber-optic lin ks. However, traditional electronic packaging of the VCSEL's and detectors severely limits the performance of these new devices. In two previous paper s from this laboratory [1], [2], traditional laser packages were described, modeled, measured and evaluated, Further, a new improved conceptual packag e, referred to as the optical package for advanced lasers (OPAL), was prese nted, as were a set of design guidelines for a new generation of packages f or VCSEL's and detectors. This paper. describing a continuation of the prev ious work [1], [2], discusses the design, modeling, fabrication, and demons tration of OPAL's in a laboratory environment, Measured results recorded fr om VCSEL's packaged in OPAL's operating to 5 Gbit/s data rates are presente d.