Die-cracking and reliable die design for flip-chip assemblies (vol 22, pg 602, 1999)

Authors
Michaelides, S Sitaraman, SK
Citation
S. Michaelides et Sk. Sitaraman, Die-cracking and reliable die design for flip-chip assemblies (vol 22, pg 602, 1999), IEEE T AD P, 23(1), 2000, pp. 121-121
Citations number
1
Categorie Soggetti
Material Science & Engineering
Journal title
IEEE TRANSACTIONS ON ADVANCED PACKAGING
ISSN journal
15213323 → ACNP
Volume
23
Issue
1
Year of publication
2000
Pages
121 - 121
Database
ISI
SICI code
1521-3323(200002)23:1<121:DARDDF>2.0.ZU;2-F