Low cycle fatigue analysis of temperature and frequency effects in eutectic solder alloy

Citation
Xq. Shi et al., Low cycle fatigue analysis of temperature and frequency effects in eutectic solder alloy, INT J FATIG, 22(3), 2000, pp. 217-228
Citations number
24
Categorie Soggetti
Material Science & Engineering
Journal title
INTERNATIONAL JOURNAL OF FATIGUE
ISSN journal
01421123 → ACNP
Volume
22
Issue
3
Year of publication
2000
Pages
217 - 228
Database
ISI
SICI code
0142-1123(200003)22:3<217:LCFAOT>2.0.ZU;2-E
Abstract
Low cycle isothermal mechanical fatigue testing of a euteutic alloy 63Sn/37 Pb was carried out in a systematic manner over a wide range of frequencies (10(-4)-1 Hz) and temperatures (-40 to 150 degrees C) with the total strain set at different values (1-50%). The low cycle fatigue behavior of the eut ectic solder was found to be strongly dependent on test temperature and fre quency. If the Coffin-Manson model is used to describe such fatigue behavio r, the fatigue exponent in and ductility coefficient C in the model are fou nd to be a function of temperature and frequency rather than numerical cons tants. The plastic flow law was employed to explain the temperature and fre quency dependence. The frequency-modified Coffin-Manson model was tried and found to be able to eliminate the frequency dependence of the numerical "c onstants" but not the temperature dependence. To have a full description of the temperature- and frequency-dependent fatigue behavior, a set of empiri cal formulae was derived based on the frequency-modified Coffin-Manson mode l. (C) 2000 Elsevier Science Ltd. All rights reserved.