Low-dose n-type nitrogen implants in 6H-SiC have been studied using the Hal
l effect. Previous studies of doping by implantation in SiC have concentrat
ed on heavily doped layers such as required for transistor sources and drai
ns. Here, we focus on more lightly doped layers, e.g., such as required for
the active regions of high-voltage power devices. The low-dose N implants
are found to activate more readily than high doses. Almost ideal N-implante
d layers with a donor density of similar to 1 x 10(17)/cm(3) and a low resi
dual acceptor density from implant damage of only similar to 1.5 x 10(15)/c
m(3) have been obtained after a 1400 degrees C anneal. (C) 2000 American In
stitute of Physics. [S0003-6951(00)03714-1].