Chalcopyrite bioleaching kinetics has been improved by using catalytic ions
able to modify the mechanism of electrochemical dissolution of chalcopyrit
e through its fixation on the sulphide surfaces. Among these cations, silve
r has been proven to be the most effective ion for chalcopyrite dissolution
with mesophilic microorganisms (35 degrees C).
In this way, bioleaching kinetics has been accelerated by means of thermoph
ilic microorganisms (68 degrees C). However, different studies with these b
acteria and in the presence of silver have shown no improvement in the copp
er recovery.
This scattered behaviour of the silver-catalysed chalcopyrite bioleaching a
t 35 degrees and 68 degrees C leads to several questions, such us: is there
a different mechanism of the silver attack at each temperature?, is there
any problem associated with the toxic effect of the catalytic ion on the th
ermophilic microorganisms? or simply, the surface film formed by the intera
ction between Ag+ ions and chalcopyrite is different?
In an attempt to answer these questions, the influence of the catalyst conc
entration on chalcopyrite bioleaching at 35 degrees and 68 degrees C has be
en examined at first place. Furthermore, the composition of the different p
hases formed on the mineral surface during the attack has been analysed by
EDX and electron microprobe. Finally, the bacterial attack on the chalcopyr
ite has been simulated in an electrochemical cell.
The results show that the chalcopyrite attack at 35 degrees and 68 degrees
C takes place through different mechanisms, as a consequence of the formati
on of different compounds during the interactions between silver ions and c
halcopyrite. At 35 degrees C a thin layer of silver sulphide was formed, wh
ereas at 68 degrees C a thicker film, mainly formed by metallic silver, was
detected. Evidence of a high silver penetration through chalcopyrite crack
s at 35 degrees C compared to a silver deposition only on the surface at 68
degrees C was obtained.