Directional solidification of TiAl-Si alloys using a polycrystalline seed

Citation
Se. Kim et al., Directional solidification of TiAl-Si alloys using a polycrystalline seed, INTERMETALL, 8(4), 2000, pp. 399-405
Citations number
21
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
INTERMETALLICS
ISSN journal
09669795 → ACNP
Volume
8
Issue
4
Year of publication
2000
Pages
399 - 405
Database
ISI
SICI code
0966-9795(200004)8:4<399:DSOTAU>2.0.ZU;2-I
Abstract
Directional solidification (DS) process of Ti'43Al-3Si alloys has been stud ied. Successful DS ingots having not only fully lamellar microstructure par allel to longitudinal axis but also rotated columnar grains with respect to longitudinal axis were obtained using a polycrystalline seed material. Suc cessful seeding and growing require plane-front solidification condition du ring the entire DS process. Fracture toughness of the DS alloys were superi or to the PST alloys, with a value of K-Q = 21.7-31.7 MPa (m)(1/2) for the crack arrest/divide mode and K-Q = 7.4-19.0 MPa (m)(1/2) for the short tran sverse mode. The orientation dependence of fracture toughness for the crack arrest/divide mode was improved in the DS alloy compared to the PST alloy. (C) 2000 Elsevier Science Ltd. All rights reserved.