Improving thermal conductivity of aluminum nitride ceramics by refining microstructure

Authors
Liu, YC Zhou, HP Wu, Y Qiao, L
Citation
Yc. Liu et al., Improving thermal conductivity of aluminum nitride ceramics by refining microstructure, MATER LETT, 43(3), 2000, pp. 114-117
Citations number
13
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
MATERIALS LETTERS
ISSN journal
0167577X → ACNP
Volume
43
Issue
3
Year of publication
2000
Pages
114 - 117
Database
ISI
SICI code
0167-577X(200004)43:3<114:ITCOAN>2.0.ZU;2-L
Abstract
A reheating process was developed to improve the thermal conductivity of lo w-temperature sintered aluminum nitride kceramics with Dy2O3, Li2O and CaO as additives. After the period of reheating, the amount of secondary phase was reduced to a very low level through carbothermal reduction. Microstruct ural investigation showed that the better the microstructure, the higher th e thermal conductivity. (C) 2000 Elsevier Science B.V. All rights reserved.