Influence of Czochralski silicon crystal growth on wafer quality: an extensive investigation using traditional and new characterization techniques

Citation
M. Porrini et al., Influence of Czochralski silicon crystal growth on wafer quality: an extensive investigation using traditional and new characterization techniques, MAT SCI E B, 73(1-3), 2000, pp. 139-144
Citations number
13
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY
ISSN journal
09215107 → ACNP
Volume
73
Issue
1-3
Year of publication
2000
Pages
139 - 144
Database
ISI
SICI code
0921-5107(20000403)73:1-3<139:IOCSCG>2.0.ZU;2-U
Abstract
In this paper results on the relationship between Czochralski silicon cryst al growth and wafer quality characteristics are presented. Several crystals grown with different oxygen content and growth parameters are examined. Th e growth parameters are varied in order to obtain different types and distr ibutions of intrinsic point defects, namely vacancies and interstitials. Tr aditional. and more recent characterization techniques are applied in this analysis, such as gate oxide integrity and light point defects evaluation, or high resolution lifetime mapping. In this way, a comprehensive picture i s generated of the properties of a silicon wafer and how it is impacted by the crystal growth process. (C) 2000 Elsevier Science S.A. All rights reser ved.