Citation
Tw. Ellis et al., Copper: Emerging material for wire bond assembly, SOL ST TECH, 43(4), 2000, pp. 71
Citations number
10
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
SOLID STATE TECHNOLOGY
ISSN journal
0038111X
→ ACNP
Volume
43
Issue
4
Year of publication
2000
Database
ISI
SICI code
0038-111X(200004)43:4<71:CEMFWB>2.0.ZU;2-W
Abstract
Copper is being re-evaluated as material for wire bonding because of the em
ergence current status of copper wire bonding, including for special proces
ses to address the challenges created by the new systems.