In situ deposition of sputtered PZT films: control of the growth temperature by the sputtered lead flux

Citation
G. Velu et D. Remiens, In situ deposition of sputtered PZT films: control of the growth temperature by the sputtered lead flux, VACUUM, 56(3), 2000, pp. 199-204
Citations number
12
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
VACUUM
ISSN journal
0042207X → ACNP
Volume
56
Issue
3
Year of publication
2000
Pages
199 - 204
Database
ISI
SICI code
0042-207X(200003)56:3<199:ISDOSP>2.0.ZU;2-3
Abstract
PZT (54/46) thin films were deposited in situ (without post-annealing treat ment) by r.f. magnetron sputtering on platinized silicon substrates. The pa rameters which have a strong influence on the perovskite phase formation ar e the sputtered lead Aux and the substrate temperature. For all the targets used in these experiments, which contain different lead excess, an equilib rium zone exists where the incorporated lead saturates at the right composi tion. The temperature at which this zone appears increased with increasing lead content in the target, i.e. when the lead species arrival at the subst rates increased. By using this self-control mechanism we have deposited PZT films at low temperature, i.e. 510 degrees C, which is largely compatible with silicon substrates. The electrical properties of the films have been e valuated. (C) 2000 Elsevier Science Ltd. All rights reserved.