Quantitative characterization of interfaces in rubber-rubber blends by means of modulated-temperature DSC

Citation
Dj. Hourston et M. Song, Quantitative characterization of interfaces in rubber-rubber blends by means of modulated-temperature DSC, J APPL POLY, 76(12), 2000, pp. 1791-1798
Citations number
12
Categorie Soggetti
Organic Chemistry/Polymer Science","Material Science & Engineering
Journal title
JOURNAL OF APPLIED POLYMER SCIENCE
ISSN journal
00218995 → ACNP
Volume
76
Issue
12
Year of publication
2000
Pages
1791 - 1798
Database
ISI
SICI code
0021-8995(20000620)76:12<1791:QCOIIR>2.0.ZU;2-U
Abstract
Rubber-rubber blends are used widely in industry, for example, in tire manu facture. It is often difficult to characterize interfaces in such rubber-ru bber blends quantitatively because of the similarity in the chemical struct ure of the component rubbers. Here, a new method was suggested for the meas urement of the weight fraction of the interface in rubber-rubber blends usi ng modulated-temperature differential scanning calorimetry (M-TDSC). Quanti tative analysis using the differential of the heat capacity, dCp/dT, versus the temperature signal from M-TDSC allows the weight fraction of the inter face to be calculated. As examples, polybutadiene rubber (BR)-natural rubbe r (NR), BR-styrene-co-butadiene rubber (SBR), SBR-NR, and nitrile rubber (N BR)-NR blend systems were analyzed. The interfacial content in these blends was obtained. SBR is partially miscible with BR. The cis-structure content in BR has an obvious effect on the extent of mixing in the SBR-BR blends. With increasing styrene content in the SBR in the SBR-BR blends, the interf ace content decreases. NR is partially miscible with both BR and SBR. The N BR used in this research is essentially immiscible with NR. The maximum amo unt of interface was found to be at the 50:50 blend composition in BT-NR, S BR-BR, and SBR-NR systems. Quantitative analysis of interfaces in these ble nd systems is reported for the first time. (C) 2000 John Wiley & Sons, Inc.