Km. Jordan et Jo. Iroh, EFFECT OF ISOTHERMAL AGING ON POST-IMIDIZATION AND GLASS-TRANSITION TEMPERATURE OF LARC-IA POLYIMIDE RESIN, Polymer composites, 18(3), 1997, pp. 397-404
The isothermal aging of partially imidized NASA Langley Research Cente
r, LaRC-IA polyimide resin containing 70 wt% N-methyl pyrrolidone, NMP
was performed in a vacuum oven at 65, 95, 135, 165 and 200 degrees C
for 0.5, 1.0, 1.5 and 2 h. The weight loss and chemical changes that o
ccurred during aging was determined gravimetrically and by FTIR spectr
oscopy, respectively. The imide absorption peak at 1778 cm(-1), increa
sed in intensity as the aging temperature was increased from 65 to 200
degrees C. The expulsion of NMP (70 wt%) was completed after similar
to 2.5 h of aging at 135 degrees C. Additional weight loss less than o
r equal to 4 wt%, after the expulsion of NMP, was attributed to post-i
midization. The imide carbonyl peak absorption at 1721 and 1778 cm(-1)
respectively, were broadened after aging at 200 degrees C. The broade
ning of the imide absorption peaks was marked by the disappearance of
the amide peak near 1660 cm(-1) and is attributable to post-imidizatio
n of the partially imidized polyamic-acid. Dissolution of the polyimid
e aged at T greater than or equal to 165 degrees C in dimethyl formami
de, DMF, was unsuccessful even after long times of stirring (similar t
o 12 h) at elevated temperature (T 85 degrees C). The DSC thermogram f
or the LaRC-IA resin showed a series of broad endothermic peaks betwee
n 150-180 degrees C and narrow endothermic peaks at 210 degrees C. The
low temperature endotherm disappeared after aging at T greater than o
r equal to 135 degrees C for t greater than or equal to 1 h. The high
temperature endotherm decreased with increased aging temperature and t
ime. The glass transition temperature of the polyimide increased with
increased aging temperature and time.