We report the concept and demonstration of a nanoscale ultra-thin-body sili
con-on-insulator (SOI) P-channel MOSFET with a Si1-xGex/Si heterostructure
channel. First, a novel lateral solid-phase epitaxy process is employed to
form an ultra-thin-body that suppresses the short-channel effects. Negligib
le threshold voltage roil-off is observed down to a channel Length of 50 nm
, Second, a selective silicon implant that breaks up the interfacial oxide
is shown to facilitate unilateral crystallization to form a single crystall
ine channel. Third, the incorporation of SiGe in the channel resulted in a
70% enhancement in the drive current.