A fabrication process has been developed which allows the beveled-edge-type
of avalanche photodiode (APD) to be made without the need for the artful b
evel formation steps. This new process, applicable to both APD arrays and t
o discrete detectors, greatly simplifies manufacture and should lead to sig
nificant cost reduction for such photodetectors. This is achieved through a
simple innovation that allows isolation around the device or array pixel t
o be brought into the plane of the surface of the silicon wafer, hence a pl
anar process. A description of the new process is presented along with perf
ormance data for a variety of APD device and array configurations. APD arra
y pixel gains in excess of 10 000 have been measured. Array pixel coinciden
ce timing resolution of less than 5 ns has been demonstrated. An energy res
olution of 6% for 662 keV gamma-rays using a CsI(T1) scintillator on a plan
ar processed large-area APD has been recorded. Discrete APDs with active ar
eas up to 13 cm(2) have been operated. (C) 2000 Elsevier Science B.V. All r
ights reserved.