SiOx films with thickness ranging from 50 nm to several micrometres were ev
aporated on crystalline Si at different O-2 pressures. The stress of these
films, evaluated by profilometer measurements, is tensile and increases wit
h increasing O-2 pressure. Atomic force microscopy data show a quite smooth
surface of the SiOx films, with a rms roughness less than 1 nm for all fil
m deposited at low O-2 pressures. The growth in a reactive atmosphere incre
ases the roughness to 1.5 nm and changes strongly the film morphology. Surf
ace morphology also evolves on the thickness, following a dynamic growth mo
del with negligible surface diffusion. The chemical composition and the inn
er structure were investigated by Raman spectroscopy.