Residual stress studies in graded W/Cu materials by neutron diffraction method

The combination of high thermal and electrical conductivity of copper with thermal resistance of tungsten is of great interest for industry. The diffe rent heat expansion coefficients, however, post: a serious problem to the c oexistence of the two phases. The possible solution can be found in creatin g a composition gradient between the two metals. The aims of the present wo rk were to investigate the residual stress states in various W/Cu gradient materials and to compare the experimental results with model simulations. ( C) 2000 Elsevier Science B.V. All rights reserved.