G. Ritter et al., Two- and three-dimensional numerical modeling of copper electroplating foradvanced ULSI metallization, SOL ST ELEC, 44(5), 2000, pp. 797-807
In this paper various electrochemical copper deposition (ECD) methods will
be reviewed and the advantages of electrochemical deposition demonstrated.
In order to understand the electrochemical deposition process and to improv
e the uniformity of copper layers deposited on large Si wafers, modeling of
ECD is necessary. Important components of a numerical model and the benefi
ts of simplified simulations are discussed. Several two- and three-dimensio
nal simulations are presented illustrating some of the challenges in growin
g uniform copper films. In addition to macro-scale modeling, micro-scale pr
edictions of the copper filling characteristics of circuit features on a wa
fer (i.e., high-aspect ratio trenches) are another important modeling appli
cation. Selected micro-scale modeling results from the literature will be r
eviewed. (C) 2000 Published by Elsevier Science Ltd. All rights reserved.