Dopant diffusion during rapid thermal oxidation

Citation
A. Stadler et al., Dopant diffusion during rapid thermal oxidation, SOL ST ELEC, 44(5), 2000, pp. 831-835
Citations number
6
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Eletrical & Eletronics Engineeing
Journal title
SOLID-STATE ELECTRONICS
ISSN journal
00381101 → ACNP
Volume
44
Issue
5
Year of publication
2000
Pages
831 - 835
Database
ISI
SICI code
0038-1101(200005)44:5<831:DDDRTO>2.0.ZU;2-Q
Abstract
Rapid thermal processing (RTP) is of increasing interest in silicon mainstr eam technology providing reduced thermal budget. In this paper the dopant d iffusion behaviour during rapid thermal oxidation (RTO) is investigated, in particular the oxidation enhanced diffusion (OED). For diffusion monitorin g, samples were fabricated by means of molecular beam epitaxy (MBE) to crea te sharp doping profiles with nanometer resolution. After various RTO treat ments (dry and wet oxide) resulting in an ellipsometric measured oxide thic kness of 5 nm, the distribution of dopants was analysed by secondary ion ma ss spectroscopy (SIMS) and compared with standard thermal processes. Metal- oxide-semiconductor structures (MOS-structures) were fabricated for electri cal characterisation, It turns out that for a low thermal budget and minimi sed OED only wet RTO is feasible.(C) 2000 Published by Elsevier Science Ltd . All rights reserved.