Toward optimizing enhanced surfaces for passive immersion cooled heat sinks

Citation
Cs. Baldwin et al., Toward optimizing enhanced surfaces for passive immersion cooled heat sinks, IEEE T COMP, 23(1), 2000, pp. 70-79
Citations number
24
Categorie Soggetti
Material Science & Engineering
Journal title
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
ISSN journal
15213331 → ACNP
Volume
23
Issue
1
Year of publication
2000
Pages
70 - 79
Database
ISI
SICI code
1521-3331(200003)23:1<70:TOESFP>2.0.ZU;2-U
Abstract
Reduction in die feature-size due to improvements in microelectronics fabri cation technology have increased the demands on effective thermal managemen t. As a consequence, innovative heat removal schemes need to be explored. I mmersion cooling in a dielectric fluid, despite the increased complications , continues to be studied as a possible solution. The characteristics of a surface used as a pool boiling heat sink depend on its microscopic features . This paper reports results from an investigation in which the shape and s pacing of these microscopic features were studied in order to achieve impro ved thermal performance, The heat sources sere thin-film heaters deposited in an array on a silicon safer which was immersed in FC-72.