Reduction in die feature-size due to improvements in microelectronics fabri
cation technology have increased the demands on effective thermal managemen
t. As a consequence, innovative heat removal schemes need to be explored. I
mmersion cooling in a dielectric fluid, despite the increased complications
, continues to be studied as a possible solution. The characteristics of a
surface used as a pool boiling heat sink depend on its microscopic features
. This paper reports results from an investigation in which the shape and s
pacing of these microscopic features were studied in order to achieve impro
ved thermal performance, The heat sources sere thin-film heaters deposited
in an array on a silicon safer which was immersed in FC-72.