Fundamental investigation of roll bond heat pipe as heat spreader plate for notebook computers

Authors
Take, K Furukawa, Y Ushioda, S
Citation
K. Take et al., Fundamental investigation of roll bond heat pipe as heat spreader plate for notebook computers, IEEE T COMP, 23(1), 2000, pp. 80-85
Citations number
6
Categorie Soggetti
Material Science & Engineering
Journal title
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
ISSN journal
15213331 → ACNP
Volume
23
Issue
1
Year of publication
2000
Pages
80 - 85
Database
ISI
SICI code
1521-3331(200003)23:1<80:FIORBH>2.0.ZU;2-6
Abstract
A roll bond heat pipe (RBHP) is very promising in the cooling of electronic equipment such as notebook computers. This study presents prediction data on maximum capillary limit obtained for the RBHP with 7.8 mm wide now chann el. Further, experimental study has been conducted to show the difference b etween the highest and lowest temperatures on the RBHP. These data determin e the optimum working fluid charge volume and number of capillary loops for the RBHP.