Advanced cooling system using miniature heat pipes in mobile PC

This paper describes various cooling solutions using heat pipes for cooling a notebook PC. Namely, 1) heat pipe with heat spreader plate, 2) hybrid sy stem-i.e., heat pipe with heat sink and fan, and 3) hinged heat pipe system . For heat input of less than 12 W, the thermal resistance measured between the surface of the CPU to ambient obtained as follows: greater than 8 degr ees C/W for system 1) and 4-6 degrees C/W for systems 2) and 3). For the CP U having specification of surface temperature of 95 degrees C and 40 degree s C ambient, then system 1) can be dissipated by about 6 W, whereas systems 2) and 3) can handle 13 W. Experimental results of these three systems are included and discussed in this paper.