This paper describes various cooling solutions using heat pipes for cooling
a notebook PC. Namely, 1) heat pipe with heat spreader plate, 2) hybrid sy
stem-i.e., heat pipe with heat sink and fan, and 3) hinged heat pipe system
. For heat input of less than 12 W, the thermal resistance measured between
the surface of the CPU to ambient obtained as follows: greater than 8 degr
ees C/W for system 1) and 4-6 degrees C/W for systems 2) and 3). For the CP
U having specification of surface temperature of 95 degrees C and 40 degree
s C ambient, then system 1) can be dissipated by about 6 W, whereas systems
2) and 3) can handle 13 W. Experimental results of these three systems are
included and discussed in this paper.