Wave soldering bumping process incorporating electroless nickel UBM

Authors
Lin, KL Chen, JW
Citation
Kl. Lin et Jw. Chen, Wave soldering bumping process incorporating electroless nickel UBM, IEEE T COMP, 23(1), 2000, pp. 143-150
Citations number
9
Categorie Soggetti
Material Science & Engineering
Journal title
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
ISSN journal
15213331 → ACNP
Volume
23
Issue
1
Year of publication
2000
Pages
143 - 150
Database
ISI
SICI code
1521-3331(200003)23:1<143:WSBPIE>2.0.ZU;2-J
Abstract
The Si/Ti/Cu/electroless nickel/solder bump was produced incorporating wave soldering without flux. The most suitable wave soldering condition for dep ositing solder is presented. The material interactions occurring during wav e soldering, afterwards reflow and extended heat treatment were found to pr oduce Ni3Sn2, Ni3Sn4, and Ni4Sn compounds between solder and electroless ni ckel deposit. The thickness of electroless nickel deposit required for bein g the barrier layer of the solder bump was investigated by reflow process.