Full software analysis and impedance matching of radio frequency CMOS integrated circuits

We present a systematic analysis technique of complementary metal-oxide-sem iconductor (CMOS) radio-frequency (RF) integrated circuits (IC's). A full s imulation program with integrated circuit emphasis (SPICE) simulation of th e whole chip including the package and the die, with the parameters extract ed from purely software analysis, has been performed. It is shown that the RF impedance matching without S-parameter based techniques is possible and the measured results agree well with our SPICE-only software based techniqu e.