We present a systematic analysis technique of complementary metal-oxide-sem
iconductor (CMOS) radio-frequency (RF) integrated circuits (IC's). A full s
imulation program with integrated circuit emphasis (SPICE) simulation of th
e whole chip including the package and the die, with the parameters extract
ed from purely software analysis, has been performed. It is shown that the
RF impedance matching without S-parameter based techniques is possible and
the measured results agree well with our SPICE-only software based techniqu
e.